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LIS3LV02DQ
MEMS INERTIAL SENSOR 3-Axis - 2g/6g Digital Output Low Voltage Linear Accelerometer
Features

2.16V TO 3.6V SINGLE SUPPLY OPERATION 1.8V COMPATIBLE IOs I2C/SPI DIGITAL OUTPUT INTERFACES PROGRAMMABLE 12 or 16 BIT DATA REPRESENTATION INTERRUPT ACTIVATED BY MOTION PROGRAMMABLE INTERRUPT THRESHOLD EMBEDDED SELF TEST HIGH SHOCK SURVIVABILITY ECO-PACK COMPLIANT QFPN-28 trimmed to better match the sensing element characteristics. The LIS3LV02DQ has a user selectable full scale of 2g, 6g and it is capable of measuring acceleration over a bandwidth of 640 Hz for all axes. The device bandwidth may be selected accordingly to the application requirements. A self-test capability allows the user to check the functioning of the system The device may be configured to generate an inertial wake-up/free-fall interrupt signal when a programmable acceleration threshold is crossed at least in one of the three axes. The LIS3LV02DQ is available in plastic SMD package and it is specified over a temperature range extending from -40C to +85C. The LIS3LV02DQ belongs to a family of products suitable for a variety of applications:

Description
The LIS3LV02DQ is a three axes digital output linear accelerometer that includes a sensing element and an IC interface able to take the information from the sensing element and to provide the measured acceleration signals to the external world through an I2C/SPI serial interface. The sensing element, capable of detecting the acceleration, is manufactured using a dedicated process developed by ST to produce inertial sensors and actuators in silicon. The IC interface instead is manufactured using a CMOS process that allows high level of integration to design a dedicated circuit which is factory
Free-Fall detection Motion activated functions in portable terminals Antitheft systems and Inertial navigation Gaming and Virtual Reality input devices Vibration Monitoring and Compensation
Order codes
Part number LIS3LV02DQ LIS3LV02DQ-TR Op. Temp. range, C -40 to +85 -40 to +85 Package QFPN-28 QFPN-28 Packing Tray Tape and Reel
October 2005
CD00047926
Rev 1 1/42
www.st.com
42
LIS3LV02DQ
Contents
1 Block Diagram & Pin Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
1.1 1.2 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 QFN Pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2
Mechanical and Electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2.1 2.2 2.3 2.4 Mechanical characteristics1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Electrical characteristics1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Terminology . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
2.4.1 2.4.2 2.4.3 Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Zero-g level . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Self Test . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
3
Functionality . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
3.1 3.2 3.3 Sensing element . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 IC Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Factory calibration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
4
Application Hints . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
4.1 Soldering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
5
Digital Interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
5.1 5.2 I2C Serial Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
5.1.1 I2C Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
SPI Bus Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
5.2.1 5.2.2 5.2.3 SPI Read . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 SPI Write . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 SPI Read in 3-wires mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
6 7
Register mapping . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 Register Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
7.1 WHO_AM_I (0Fh) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
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LIS3LV02DQ 7.2 7.3 7.4 7.5 7.6 7.7 7.8 7.9 7.10 7.11 7.12 7.13 7.14 7.15 7.16 7.17 7.18 7.19 7.20 7.21 7.22 7.23 7.24 7.25 7.26 7.27 7.28 7.29 7.30 7.31 OFFSET_X (16h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 OFFSET_Y (17h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 OFFSET_Z (18h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 GAIN_X (19h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 GAIN_Y (1Ah) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 GAIN_Z (1Bh) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 CTRL_REG1 (20h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 CTRL_REG2 (21h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 CTRL_REG3 (22h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 HP_FILTER_RESET (23h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 STATUS_REG (27h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 OUTX_L (28h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 OUTX_H (29h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 OUTY_L (2Ah) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 OUTY_H (2Bh) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 OUTZ_L (2Ch) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 OUTZ_H (2Dh) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 FF_WU_CFG (30h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 FF_WU_SRC (31h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 FF_WU_ACK (32h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 FF_WU_THS_L (34h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 FF_WU_THS_H (35h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 FF_WU_DURATION (36h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 DD_CFG (38h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 DD_SRC (39h) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 DD_ACK (3Ah) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 DD_THSI_L (3Ch) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 DD_THSI_H (3Dh) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 DD_THSE_L (3Eh) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 DD_THSE_H (3Fh) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
8
Typical performance characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
8.1 Mechanical Characteristics at 25C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
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LIS3LV02DQ 8.2 8.3 Mechanical Characteristics derived from measurement in the -40C to +85C temperature range
38
Electro-Mechanical characteristics at 25C . . . . . . . . . . . . . . . . . . . . . . . . . 39
9 10
Package Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
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LIS3LV02DQ
1 Block Diagram & Pin Description
1
1.1
Block Diagram & Pin Description
Block diagram
Figure 1. Block Diagram
X+ Y+ Z+
CHARGE AMPLIFIER
MUX DE MUX
Reconstruction Filter IC
2
CS SCL/SPC SDA/SDO/SDI SDO
a
ZY X-
Reconstruction Filter
Regs Array
SPI
Reconstruction Filter
SELF TEST
REFERENCE
TRIMMING CIRCUITS
CLOCK
CONTROL LOGIC & INTERRUPT GEN.
RDY/INT
1.2
QFPN-28 Pin description
Figure 2. Pin Connection
NC NC NC NC NC NC NC
22
28
Z
1 Y
NC 1 GND VDD Reserved
21 NC
Reserved VDD
X
GND RDY/INT NC 7
LIS3LV02DQ (TOP VIEW)
Reserved GND CK
15 NC
DIRECTION OF THE DETECTABLE ACCELERATIONS
8
14
SDA/SDI/SDO
VDD_IO
SDO
SCL/SPC
CS
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NC
NC
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1 Block Diagram & Pin Description
LIS3LV02DQ
Table 1.
Pin# 1 2 3 4 5 6 7, 8 9
Pin description
Name NC GND Vdd Reserved GND RDY/INT NC SDO SDA/ SDI/ SDO Vdd_IO SCL/SPC Internally not connected 0V supply Power supply Either leave unconnected or connect to GND 0V supply Data ready/inertial wake-up and free-fall interrupt Internally not connected SPI Serial Data Output I2C Serial Data (SDA) SPI Serial Data Input (SDI) 3-wire Interface Serial Data Output (SDO) Power supply for I/O pads I2C Serial Clock (SCL) SPI Serial Port Clock (SPC) SPI enable I2C/SPI mode selection (1: I2C mode; 0: SPI enabled) Internally not connected Optional External clock, if not used either leave unconnected or connect to GND 0V supply Either leave unconnected or connect to Vdd_IO Power supply Connect to Vdd Internally not connected Function
10
11 12
13 14, 15 16 17 18 19 20 21-28
CS NC CK GND Reserved Vdd Reserved NC
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2 Mechanical and Electrical specifications
2
2.1
Table 2.
Symbol FS
Mechanical and Electrical specifications
Mechanical characteristics1
Mechanical Characteristics (All the parameters are specified @ Vdd=2.5V, T=25C unless otherwise noted)
Parameter Measurement range3 Test conditions FS bit set to 0 FS bit set to 1 Full-scale = 2g BW=40Hz Full-scale = 2g, 12 bit representation So Sensitivity Full-scale = 6g, 12 bit representation TCS0 Sensitivity Change Vs Temperature Full-scale = 2g, 12 bit representation Full-scale = 2g X, Y axis Full-scale = 2g Z axis Full-scale = 6g X, Y axis Full-scale = 6g Z axis Full-scale = 2g X, Y axis Full-scale = 2g Z axis Full-scale = 6g X, Y axis Full-scale = 6g Z axis TCOff Zero-g Level Change Vs Temperature Max Delta from 25C -20 -40 -40 -60 -2 -5 -1 -2 0.2 323 340 0.025 +20 +40 +40 +60 +2 +5 +1 +2 357 LSb/g %/C mg mg mg mg %FS %FS %FS %FS mg/C 974 Min. 1.8 5.6 Typ.2 2.0 6.0 1.0 1024 1074 Max. Unit g g mg LSb/g
Dres
Device Resolution
Off
Zero-g Level Offset Accuracy4,5
LTOff
Zero-g Level Offset Long Term Accuracy6
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2 Mechanical and Electrical specifications
LIS3LV02DQ
Table 2.
Symbol
Mechanical Characteristics (continued) (All the parameters are specified @ Vdd=2.5V, T=25C unless otherwise noted)
Parameter Test conditions Best fit straight line X, Y axis Full-scale = 2g BW=40Hz Min. Typ.2 Max. Unit
2
%FS
NL
Non Linearity Best fit straight line Z axis Full-scale = 2g BW=40Hz 3 %FS
CrAx
Cross Axis Full-scale=2g X axis Full-scale=2g Y axis Full-scale=2g Z axis Full-scale=6g X axis Full-scale=6g Y axis Full-scale=6g Z axis
-3.5 100 100 30 30 30 10 240 240 150 80 80 50 ODRx/4 -40 0.2
3.5 400 400 350 130 130 120
% LSb LSb LSb LSb LSb LSb Hz
Vst
Self test Output Change
7,8
BW Top Wh
System Bandwidth9 Operating Temperature Range Product Weight
+85
C gram
Note: 1 The product is factory calibrated at 2.5V. The device can be used from 2.16V to 3.6V 2 Typical specifications are not guaranteed 3 Verified by wafer level test and measurement of initial offset and sensitivity 4 Zero-g level offset value after MSL3 preconditioning 5 Offset can be eliminated by enabling the built-in high pass filter (HPF) 6 Results of accelerated reliability tests. Report available upon request 7 Self Test output changes with the power supply. Self test "output change" is defined as OUTPUT[LSb](Self-test bit on ctrl_reg1=1)-OUTPUT[LSb](Self-test bit on ctrl_reg1=0). 1LSb=1g/1024 at 12bit representation, 2g Full-Scale 8 Output data reach 99% of final value after 5/ODR when enabling Self-Test mode due to device filtering 9 ODR is output data rate. Refer to table 4 for specifications
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Table 3.
Symbol FS
2 Mechanical and Electrical specifications
Mechanical Characteristics (All the parameters are specified @ Vdd=3.3V, T=25C unless otherwise noted)
Parameter Measurement range3 Test conditions FS bit set to 0 FS bit set to 1 Full-scale = 2g BW=40Hz Full-scale = 2g, 12 bit representation 920 306 Min. 1.7 5.3 Typ.2 2.0 6.0 1.0 1024 340 0.025 -70 -90 -90 -100 -4.5 -6 -1.8 -2.2 0.2 70 90 90 100 +4.5 +6 +1.8 +2.2 1126 374 Max. Unit g g mg LSb/g LSb/g %/C mg mg mg mg %FS %FS %FS %FS mg/C
Dres
Device Resolution
So
Sensitivity Full-scale = 6g, 12 bit representation
TCS0
Sensitivity Change Vs Temperature
Full-scale = 2g, 12 bit representation Full-scale = 2g X, Y axis Full-scale = 2g Z axis Full-scale = 6g X, Y axis Full-scale = 6g Z axis Full-scale = 2g X, Y axis Full-scale = 2g Z axis Full-scale = 6g X, Y axis Full-scale = 6g Z axis
Off
Zero-g Level Offset Accuracy4,5
LTOff
Zero-g Level Offset Long Term Accuracy6
TCOff
Zero-g Level Change Vs Temperature
Max Delta from 25C Best fit straight line X, Y axis Full-scale = 2g BW=40Hz
2
%FS
NL
Non Linearity Best fit straight line Z axis Full-scale = 2g BW=40Hz 3 %FS
CrAx
Cross Axis
-3.5
3.5
%
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2 Mechanical and Electrical specifications
LIS3LV02DQ
Table 3.
Symbol
Mechanical Characteristics (continued) (All the parameters are specified @ Vdd=3.3V, T=25C unless otherwise noted)
Parameter Test conditions Full-scale=2g X axis Full-scale=2g Y axis Full-scale=2g Z axis Full-scale=6g X axis Full-scale=6g Y axis Full-scale=6g Z axis Min. 250 250 100 80 80 30 Typ.2 550 550 350 180 180 120 ODRx/4 -40 0.2 +85 Max. 900 900 600 300 300 200 Unit LSb LSb LSb LSb LSb LSb Hz C gram
Vst
Self test Output Change
7,8
BW Top Wh
System Bandwidth9 Operating Temperature Range Product Weight
Note: 1 The product is factory calibrated at 2.5V. The device can be used from 2.16V to 3.6V 2 Typical specifications are not guaranteed 3 Verified by wafer level test and measurement of initial offset and sensitivity 4 Zero-g level offset value after MSL3 preconditioning 5 Offset can be eliminated by enabling the built-in high pass filter (HPF) 6 Results of accelerated reliability tests 7 Self Test output changes with the power supply. Self test "output change" is defined as OUTPUT[LSb](Self-test bit on ctrl_reg1=1)-OUTPUT[LSb](Self-test bit on ctrl_reg1=0). 1LSb=1g/1024 at 12bit representation, 2g Full-Scale 8 Output data reach 99% of final value after 5/ODR when enabling Self-Test mode due to device filtering 9 ODR is output data rate. Refer to table 4 for specifications
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2 Mechanical and Electrical specifications
2.2
Table 4.
Symbol Vdd Vdd_IO Idd
Electrical characteristics1
Electrical Characteristics (All the parameters are specified @ Vdd=2.5V, T=25C unless otherwise noted)
Parameter Supply voltage I/O pads Supply voltage T = 25C, Vdd=2.5V Supply current T = 25C, Vdd=3.3V 0.65 0.8*Vdd _IO 0.2*Vdd _IO 0.9*Vdd _IO 0.1*Vdd _IO T = 25C Dec factor = 512 Dec factor = 128 Dec factor = 32 Dec factor = 8 1 40 160 640 2560 ODRx/4 5/ODRx -40 +85 10 0.80 mA V V V V A Hz Hz Hz Hz Hz s C Digital High level Input voltage Digital Low level Input voltage High level Output Voltage Low level Output Voltage Current consumption in Power-down mode Output Data Rate1 Output Data Rate 2 Output Data Rate 3 Output Data Rate 4 System Bandwidth3 Turn-on time4 Operating Temperature Range Test conditions Min. 2.16 1.71 0.60 Typ.2 2.5 Max. 3.6 Vdd 0.75 Unit V V mA
VIH VIL VOH VOL IddPdn ODR1 ODR2 ODR3 ODR4 BW Ton Top
Note: 1 The product is factory calibrated at 2.5V. The device can be used from 2.16V to 3.6V 2 Typical specifications are not guaranteed 3 Digital filter cut-off frequency 4 Time to obtain valid data after exiting Power-Down mode
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2 Mechanical and Electrical specifications
LIS3LV02DQ
2.3
Absolute maximum ratings
Stresses above those listed as "absolute maximum ratings" may cause permanent damage to the device. This is a stress rating only and functional operation of the device under these conditions is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. Table 5.
Symbol Vdd Vdd_IO Vin Supply voltage I/O pins Supply voltage Input voltage on any control pin (CS, SCL/SPC, SDA/SDI/SDO, CK) Acceleration (Any axis, Powered, Vdd=2.5V) 10000g for 0.1 ms 3000g for 0.5 ms Acceleration (Any axis, Unpowered) 10000g for 0.1 ms Operating Temperature Range Storage Temperature Range -40 to +85 -40 to +125 4.0 (HBM) ESD Electrostatic discharge protection 200 (MM) 1.5 (CDM) C C kV V kV
Absolute maximum ratings
Ratings Maximum Value -0.3 to 6 -0.3 to Vdd +0.1 -0.3 to Vdd_IO +0.3 3000g for 0.5 ms Unit V V V
APOW
AUNP TOP TSTG
Note: 1 Supply voltage on any pin should never exceed 6.0V.
This is a Mechanical Shock sensitive device, improper handling can cause permanent damages to the part This is an ESD sensitive device, improper handling can cause permanent damages to the part
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2 Mechanical and Electrical specifications
2.4
2.4.1
Terminology
Sensitivity
Sensitivity describes the gain of the sensor and can be determined e.g. by applying 1g acceleration to it. As the sensor can measure DC accelerations this can be done easily by pointing the axis of interest towards the center of the earth, noting the output value, rotating the sensor by 180 degrees (point to the sky) and noting the output value again. By doing so, 1g acceleration is applied to the sensor. Subtracting the larger output value from the smaller one and divide the result by 2 leads to the actual sensitivity of the sensor. This value changes very little over temperature and also very little over time. The Sensitivity Tolerance describes the range of Sensitivities of a large population of sensor.
2.4.2
Zero-g level
Zero-g level Offset (Off) describes the deviation of an actual output signal from the ideal output signal if there is no acceleration present. A sensor in a steady state on a horizontal surface will measure 0g in X axis and 0g in Y axis whereas the Z axis will measure 1g. The output is ideally in the middle of the dynamic range of the sensor (content of OUT registers 00h, 00h with 16 bit representation, data expressed as 2's complement number). A deviation from ideal value in this case is called Zero-g offset. Offset is to some extent a result of stress to a precise MEMS sensor and therefore the offset can slightly change after mounting the sensor onto a printed circuit board or exposing it to extensive mechanical stress. Offset changes little over temperature, see "Zero-g level change vs. temperature". The Zero-g level of an individual sensor is stable over lifetime. The Zero-g level tolerance describes the range of Zero-g levels of a population of sensors.
2.4.3
Self Test
Self Test allows to test the mechanical and electric part of the sensor, allowing the seismic mass to be moved by means of an electrostatic test-force. The Self Test function is off when the self-test bit of ctrl_reg1 (control register 1) is programmed to `0`. When the self-test bit of ctrl_reg1 is programmed to `1` an actuation force is applied to the sensor, simulating a definite input acceleration. In this case the sensor outputs will exhibit a change in their DC levels which is related to the selected full scale and depending on the Supply Voltage through the device sensitivity. When Self Test is activated, the device output level is given by the algebraic sum of the signals produced by the acceleration acting on the sensor and by the electrostatic testforce. If the output signals change within the amplitude specified inside table 2 or table 3, than the sensor is working properly and the parameters of the interface chip are within the defined specification.
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3 Functionality
LIS3LV02DQ
3
Functionality
The LIS3LV02DQ is a high performance, low-power, digital output 3-axis linear accelerometer packaged in a QFN package. The complete device includes a sensing element and an IC interface able to take the information from the sensing element and to provide a signal to the external world through an I2C/SPI serial interface.
3.1
Sensing element
A proprietary process is used to create a surface micro-machined accelerometer. The technology allows to carry out suspended silicon structures which are attached to the substrate in a few points called anchors and are free to move in the direction of the sensed acceleration. To be compatible with the traditional packaging techniques a cap is placed on top of the sensing element to avoid blocking the moving parts during the moulding phase of the plastic encapsulation. When an acceleration is applied to the sensor the proof mass displaces from its nominal position, causing an imbalance in the capacitive half-bridge. This imbalance is measured using charge integration in response to a voltage pulse applied to the sense capacitor. At steady state the nominal value of the capacitors are few pF and when an acceleration is applied the maximum variation of the capacitive load is up to 100fF.
3.2
IC Interface
The complete measurement chain is composed by a low-noise capacitive amplifier which converts into an analog voltage the capacitive unbalancing of the MEMS sensor and by three analog-to-digital converters, one for each axis, that translate the produced signal into a digital bitstream. The converters are coupled with dedicated reconstruction filters which remove the high frequency components of the quantization noise and provide low rate and high resolution digital words. The charge amplifier and the converters are operated respectively at 61.5 kHz and 20.5 kHz. The data rate at the output of the reconstruction depends on the user selected Decimation Factor (DF) and spans from 40 Hz to 2560 Hz. The acceleration data may be accessed through an I2C/SPI interface thus making the device particularly suitable for direct interfacing with a microcontroller. The LIS3LV02DQ features a Data-Ready signal (RDY) which indicates when a new set of measured acceleration data is available thus simplifying data synchronization in digital system employing the device itself. The LIS3LV02DQ may also be configured to generate an inertial Wake-Up, Direction Detection and Free-Fall interrupt signal accordingly to a programmed acceleration event along the enabled axes.
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3 Functionality
3.3
Factory calibration
The IC interface is factory calibrated for sensitivity (So) and Zero-g level (Off). The trimming values are stored inside the device by a non volatile structure. Any time the device is turned on, the trimming parameters are downloaded into the registers to be employed during the normal operation. This allows the user to employ the device without further calibration.
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4 Application Hints
LIS3LV02DQ
4
Application Hints
Figure 3. LIS3LV02DQ Electrical Connection
28 22
Z
21
1 Y
1
10uF
LIS3LV02DQ
X
(TOP VIEW)
7
15
100nF
8
14
DIRECTION OF THE DETECTABLE ACCELERATIONS
Vdd_IO Vdd
SDA/SDI/SDO
RDY/INT
SCL/SPC
SDO
GND
Digital signal from/to signal controller.Signal's levels are defined by proper selection of Vdd_IO
The device core is supplied through Vdd line while the I/O pads are supplied through Vdd_IO line. Power supply decoupling capacitors (100 nF ceramic, 10 F Al) should be placed as near as possible to the pin 3 of the device (common design practice). All the voltage and ground supplies must be present at the same time to have proper behavior of the IC (refer to Fig. 3). It is possible to remove Vdd mantaining Vdd_IO without blocking the communication busses. The functionality of the device and the measured acceleration data is selectable and accessible through the I2C/SPI interface.When using the I2C, CS must be tied high while SDO must be left floating. Refer to application note AN2041 for further information on device usage.
4.1
Soldering Information
The QFN-28 package is lead free and green package qualified for soldering heat resistance according to JEDEC J-STD-020C. Central die pad and pin #1 indicator are physically connected to GND. Land pattern and soldering recommendations are available upon request.
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5 Digital Interfaces
5
Digital Interfaces
The registers embedded inside the LIS3LV02DQ may be accessed through both the I2C and SPI serial interfaces. The latter may be SW configured to operate either in 3-wire or 4-wire interface mode. The serial interfaces are mapped onto the same pads. To select/exploit the I2C interface, CS line must be tied high (i.e connected to Vdd_IO). Table 6. Serial interface pin description
PIN Description SPI enable I2C/SPI mode selection (1: I2C mode; 0: SPI enabled) I2C Serial Clock (SCL) SPI Serial Port Clock (SPC) I2C Serial Data (SDA) SPI Serial Data Input (SDI) 3-wire Interface Serial Data Output (SDO) SPI Serial Data Output (SDO)
PIN Name CS
SCL/SPC
SDA/SDI/SDO
SDO
5.1
I2C Serial Interface
The LIS3LV02DQ I2C is a bus slave. The I2C is employed to write the data into the registers whose content can also be read back. The relevant I2C terminology is given in the table below Table 7.
Term Transmitter Receiver Master Slave
Serial interface pin description
Description The device which sends data to the bus The device which receives data from the bus The device which initiates a transfer, generates clock signals and terminates a transfer The device addressed by the master
There are two signals associated with the I2C bus: the Serial Clock Line (SCL) and the Serial DAta line (SDA). The latter is a bidirectional line used for sending and receiving the data to/from the interface. Both the lines are connected to Vdd_IO through a pull-up resistor embedded inside the LIS3LV02DQ. When the bus is free both the lines are high. The I2C interface is compliant with Fast Mode (400 kHz) I2C standards as well as the Normal Mode.
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5 Digital Interfaces
LIS3LV02DQ
5.1.1
I2C Operation
The transaction on the bus is started through a START (ST) signal. A START condition is defined as a HIGH to LOW transition on the data line while the SCL line is held HIGH. After this has been transmitted by the Master, the bus is considered busy. The next byte of data transmitted after the start condition contains the address of the slave in the first 7 bits and the eighth bit tells whether the Master is receiving data from the slave or transmitting data to the slave. When an address is sent, each device in the system compares the first seven bits after a start condition with its address. If they match, the device considers itself addressed by the Master. The Slave ADdress (SAD) associated to the LIS3LV02DQ is 0011101b. Data transfer with acknowledge is mandatory. The transmitter must release the SDA line during the acknowledge pulse. The receiver must then pull the data line LOW so that it remains stable low during the HIGH period of the acknowledge clock pulse. A receiver which has been addressed is obliged to generate an acknowledge after each byte of data has been received. The I2C embedded inside the LIS3LV02DQ behaves like a slave device and the following protocol must be adhered to. After the start condition (ST) a salve address is sent, once a slave acknowledge (SAK) has been returned, a 8-bit sub-address will be transmitted: the 7 LSb represent the actual register address while the MSB enables address auto increment. If the MSb of the SUB field is 1, the SUB (register address) will be automatically incremented to allow multiple data read/write. The slave address is completed with a Read/Write bit. If the bit was `1' (Read), a repeated START (SR) condition will have to be issued after the two sub-address bytes; if the bit is `0' (Write) the Master will transmit to the slave with direction unchanged. Transfer when Master is writing one byte to slave
Master Slave ST SAD + W SAK SUB SAK DATA SAK SP
Transfer when Master is writing multiple bytes to slave:
Master Slave ST SAD + W SAK SUB SAK DATA SAK DATA SAK SP
Transfer when Master is receiving (reading) one byte of data from slave:
Master Slave ST SAD + W SAK SUB SAK SR SAD + R SAK DATA NMAK SP
Transfer when Master is receiving (reading) multiple bytes of data from slave
Master Slave Master Slave DATA ST SAD + W SAK MAK DATA SUB SAK SR SAD + R SAK NMAK DATA SP MAK
Data are transmitted in byte format (DATA). Each data transfer contains 8 bits. The number of bytes transferred per transfer is unlimited. Data is transferred with the Most Significant bit (MSb) first. If a receiver can't receive another complete byte of data until it has performed some other
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function, it can hold the clock line, SCL LOW to force the transmitter into a wait state. Data transfer only continues when the receiver is ready for another byte and releases the data line. If a slave receiver doesn't acknowledge the slave address (i.e. it is not able to receive because it is performing some real time function) the data line must be left HIGH by the slave. The Master can then abort the transfer. A LOW to HIGH transition on the SDA line while the SCL line is HIGH is defined as a STOP condition. Each data transfer must be terminated by the generation of a STOP (SP) condition. In order to read multiple bytes, it is necessary to assert the most significant bit of the subaddress field. In other words, SUB(7) must be equal to 1 while SUB(6-0) represents the address of first register to read. In the presented communication format MAK is Master Acknowledge and NMAK is No Master Acknowledge.
5.2
SPI Bus Interface
The LIS3LV02DQ SPI is a bus slave. The SPI allows to write and read the registers of the device. The Serial Interface interacts with the outside world with 4 wires: CS, SPC, SDI and SDO. Figure 4. Read & write protocol
CS SPC SDI
RW MS AD5 AD4 AD3 AD2 AD1 AD0 DI7 DI6 DI5 DI4 DI3 DI2 DI1 DI0
SDO
DO7 DO6 DO5 DO4 DO3 DO2 DO1 DO0
CS is the Serial Port Enable and it is controlled by the SPI master. It goes low at the start of the transmission and goes back high at the end. SPC is the Serial Port Clock and it is controlled by the SPI master. It is stopped high when CS is high (no transmission). SDI and SDO are respectively the Serial Port Data Input and Output. Those lines are driven at the falling edge of SPC and should be captured at the rising edge of SPC. Both the Read Register and Write Register commands are completed in 16 clock pulses or in multiple of 8 in case of multiple byte read/write. Bit duration is the time between two falling edges of SPC. The first bit (bit 0) starts at the first falling edge of SPC after the falling edge of CS while the last bit (bit 15, bit 23, ...) starts at the last falling edge of SPC just before the rising edge of CS.
bit 0: RW bit. When 0, the data DI(7:0) is written into the device. When 1, the data DO(7:0) from the device is read. In latter case, the chip will drive SDO at the start of bit 8. bit 1: MS bit. When 0, the address will remain unchanged in multiple read/write commands. When 1, the address will be auto incremented in multiple read/write commands. bit 2-7: address AD(5:0). This is the address field of the indexed register.
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bit 8-15: data DI(7:0) (write mode). This is the data that will be written into the device (MSb first). bit 8-15: data DO(7:0) (read mode). This is the data that will be read from the device (MSb first).
In multiple read/write commands further blocks of 8 clock periods will be added. When MS bit is 0 the address used to read/write data remains the same for every block. When MS bit is 1 the address used to read/write data is incremented at every block. The function and the behavior of SDI and SDO remain unchanged.
5.2.1
SPI Read
Figure 5. SPI Read protocol
CS SPC SDI
RW MS AD5 AD4 AD3 AD2 AD1 AD0
SDO
DO7 DO6 DO5 DO4 DO3 DO2 DO1 DO0
The SPI Read command is performed with 16 clock pulses. Multiple byte read command is performed adding blocks of 8 clock pulses at the previous one.
bit 0: READ bit. The value is 1. bit 1: MS bit. When 0 do not increment address, when 1 increment address in multiple reading. bit 2-7: address AD(5:0). This is the address field of the indexed register. bit 8-15: data DO(7:0) (read mode). This is the data that will be read from the device (MSb first). bit 16-... : data DO(...-8). Further data in multiple byte reading.
Figure 6.
CS SPC SDI
RW MS AD5 AD4 AD3 AD2 AD1 AD0
Multiple bytes SPI Read Protocol (2 bytes example)
SDO
DO7 DO6 DO5 DO4 DO3 DO2 DO1 DO0 DO15 DO14 DO13 DO12 DO11 DO10 DO9 DO8
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5.2.2
SPI Write
Figure 7. SPI Write protocol
CS SPC SDI
RW MS AD5 AD4 AD3 AD2 AD1 AD0 DI7 DI6 DI5 DI4 DI3 DI2 DI1 DI0
The SPI Write command is performed with 16 clock pulses. Multiple byte write command is performed adding blocks of 8 clock pulses at the previous one.
bit 0: WRITE bit. The value is 0. bit 1: MS bit. When 0 do not increment address, when 1 increment address in multiple writing. bit 2 -7: address AD(5:0). This is the address field of the indexed register. bit 8-15: data DI(7:0) (write mode). This is the data that will be written inside the device (MSb first). bit 16-... : data DI(...-8). Further data in multiple byte writing.
Figure 8.
CS SPC SDI
RW MS AD5 AD4 AD3 AD2 AD1 AD0 DI7 DI6 DI5 DI4 DI3 DI2 DI1 DI0 DI15 DI14 DI13 DI12 DI11 DI10 DI9 DI8
Multiple bytes SPI Write Protocol (2 bytes example)
5.2.3
SPI Read in 3-wires mode
3-wires mode is entered by setting to 1 bit SIM (SPI Serial Interface Mode selection) in CTRL_REG2. Figure 9. SPI Read protocol in 3-wires mode
CS SPC SDI/O
RW MS AD5 AD4 AD3 AD2 AD1 AD0 DO7 DO6 DO5 DO4 DO3 DO2 DO1 DO0
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5 Digital Interfaces
LIS3LV02DQ
The SPI Read command is performed with 16 clock pulses:
bit 0: READ bit. The value is 1. bit 1: MS bit. When 0 do not increment address, when 1 increment address in multiple reading. bit 2-7: address AD(5:0). This is the address field of the indexed register. bit 8-15: data DO(7:0) (read mode). This is the data that will be read from the device (MSb first).
Multiple read command is also available in 3-wires mode.
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6 Register mapping
6
Register mapping
The table given below provides a listing of the 8 bit registers embedded in the device and the related address. Table 8. Registers address map
Register Address Reg. Name Type Binary rw WHO_AM_I r rw OFFSET_X OFFSET_Y OFFSET_Z GAIN_X GAIN_Y GAIN_Z rw rw rw rw rw rw 0000000 - 0001110 0001111 0010000 - 0010101 0010110 0010111 0011000 0011001 0011010 0011011 0011100 -0011111 CTRL_REG1 CTRL_REG2 CTRL_REG3 HP_FILTER RESET rw rw rw r 0100000 0100001 0100010 0100011 0100100-0100110 STATUS_REG OUTX_L OUTX_H OUTY_L OUTY_H OUTZ_L OUTZ_H rw r r r r r r r 0100111 0101000 0101001 0101010 0101011 0101100 0101101 0101110 0101111 FF_WU_CFG FF_WU_SRC FF_WU_ACK rw rw r 0110000 0110001 0110010 0110011 FF_WU_THS_L rw 0110100 Hex 00 - 0E 0F 10 - 15 16 17 18 19 1A 1B 1C-1F 20 21 22 23 24-26 27 28 29 2A 2B 2C 2D 2E 2F 30 31 32 33 34 00000000 00000000 00000000 dummy Dummy register Not Used 00000000 output output output output output output Reserved Not Used 00000111 00000000 00001000 dummy Dummy register Not Used Calibration Calibration Calibration Calibration Calibration Calibration 00111010 Reserved Dummy register Reserved Loaded at boot Loaded at boot Loaded at boot Loaded at boot Loaded at boot Loaded at boot Reserved Default Comment
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Registers address map (continued)
Register Address Type Binary Hex 35 36 37 38 39 3A 3B 3C 3D 3E 3F 40-7F 00000000 00000000 00000000 00000000 Reserved 00000000 00000000 dummy Dummy register Not Used 00000000 00000000 Not Used rw rw 0110101 0110110 0110111 Default Comment
Table 8.
Reg. Name FF_WU_THS_H FF_WU_DURATION
DD_CFG DD_SRC DD_ACK
rw rw r
0111000 0111001 0111010 0111011
DD_THSI_L DD_THSI_H DD_THSE_L DD_THSE_H
rw rw rw rw
0111100 0111101 0111110 0111111 1000000-1111111
Registers marked as reserved must not be changed. The writing to those registers may cause permanent damages to the device. The content of the registers that are loaded at boot should not be changed. They contain the factory calibration values. Their content is automatically restored when the device is poweredup.
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7 Register Description
7
Register Description
The device contains a set of registers which are used to control its behavior and to retrieve acceleration data. The registers 7.2 to 7.7 contain the factory calibration values, it is not necessary to change their value for normal device operation.
7.1
WHO_AM_I (0Fh)
W7 W7, W0 W6 W5 W4 W3 W2 W1 W0
LIS3LV02DQ Physical Address equal to 3Ah
Addressing this register the physical address of the device is returned. For LIS3LV02DQ the physical address assigned in factory is 3Ah.
7.2
OFFSET_X (16h)
OX7 OX7, OX0 OX6 OX5 OX4 OX3 OX2 OX1 OX0
Digital Offset Trimming for X-Axis
7.3
OFFSET_Y (17h)
OY7 DOY7, DOY0 OY6 OY5 OY4 OY3 OY2 OY1 OY0
Digital Offset Trimming for Y-Axis
7.4
OFFSET_Z (18h)
OZ7 OZ7, OZ0 OZ6 OZ5 OZ4 OZ3 OZ2 OZ1 OZ0
Digital Offset Trimming for Z-Axis
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7 Register Description
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7.5
GAIN_X (19h)
GX7 GX7, GX0 GX6 GX5 GX4 GX3 GX2 GX1 GX0
Digital Gain Trimming for X-Axis
7.6
GAIN_Y (1Ah)
GY7 GY7, GY0 GY6 GY5 GY4 GY3 GY2 GY1 GY0
Digital Gain Trimming for Y-Axis
7.7
GAIN_Z (1Bh)
GZ7 GZ7, GZ0 GZ6 GZ5 GZ4 GZ3 GZ2 GZ1 GZ0
Digital Gain Trimming for Z-Axis
7.8
CTRL_REG1 (20h)
PD1 PD0 DF1 DF0 ST Zen Yen Xen
PD1, PD0 DF1, DF0 ST Zen Yen Xen
Power Down Control (00: power-down mode; 01, 10, 11: device on) Decimation Factor Control (00: decimate by 512; 01: decimate by 128; 10: decimate by 32; 11: decimate by 8) Self Test Enable (0: normal mode; 1: self-test active) Z-axis enable (0: axis off; 1: axis on) Y-axis enable (0: axis off; 1: axis on) X-axis enable (0: axis off; 1: axis on)
PD1, PD0 bit allows to turn on the turn the device out of power-down mode. The device is in power-down mode when PD1, PD0= "00" (default value after boot). The device is in normal mode when either PD1 or PD0 is set to 1. DF1, DF0 bit allows to select the data rate at which acceleration samples are produced. The default value is 00 which corresponds to a data-rate of 40Hz. By changing the content of DF1, DF0 to "01", "10" and "11" the selected data-rate will be set respectively equal to 160Hz, 640Hz and to 2560Hz.
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7 Register Description
ST bit is used to activate the self test function. When the bit is set to one, an output change will occur to the device outputs (refer to table 2 and 3 for specification) thus allowing to check the functionality of the whole measurement chain. Zen bit enables the Z-axis measurement channel when set to 1. The default value is 1. Yen bit enables the Y-axis measurement channel when set to 1. The default value is 1. Xen bit enables the X-axis measurement channel when set to 1. The default value is 1.
7.9
CTRL_REG2 (21h)
FS BDU BLE BOOT IEN DRDY SIM DAS
FS BDU BLE BOOT IEN DRDY SIM DAS
Full Scale selection (0: 2g; 1: 6g) Block Data Update (0: continuous update; 1: output registers not updated until MSB and LSB reading) Big/Little Endian selection (0: little endian; 1: big endian) Reboot memory content Interrupt ENable (0: data ready on RDY pad; 1: int req on RDY pad) Enable Data-Ready generation SPI Serial Interface Mode selection (0: 4-wire interface; 1: 3-wire interface) Data Alignment Selection (0: 12 bit right justified; 1: 16 bit left justified)
FS bit is used to select Full Scale value. After the device power-up the default full scale value is +/-2g. In order to obtain a +/-6g full scale it is necessary to set FS bit to `1'. BDU bit is used to inhibit output registers update until both upper and lower register parts are read. In default mode (BDU= `0') the output register values are updated continuously. If for any reason it is not sure to read faster than output data rate it is recommended to set BDU bit to `1'. In this way the content of output registers is not updated until both MSB and LSB are read avoiding to read values related to different sample time. BLE bit is used to select Big Endian or Little Endian representation for output registers. In Big Endian's one MSB acceleration value is located at addresses 28h (X-axis), 2Ah (Y-axis) and 2Ch (Z-axis) while LSB acceleration value is located at addresses 29h (X-axis), 2Bh (Y-axis) and 2Dh (Z-axis). In Little Endian representation (Default, BLE=`0`) the order is inverted (refer to data register description for more details). BOOT bit is used to refresh the content of internal registers stored in the flash memory block. At the device power up the content of the flash memory block is transferred to the internal registers related to trimming functions to permit a good behavior of the device itself. If for any reason the content of trimming registers was changed it is sufficient to use this bit to restore correct values. When BOOT bit is set to `1' the content of internal flash is copied inside corresponding internal registers and it is used to calibrate the device. These values are factory
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7 Register Description
LIS3LV02DQ
trimmed and they are different for every accelerometer. They permit a good behavior of the device and normally they have not to be changed. At the end of the boot process the BOOT bit is set again to `0'. IEN bit is used to switch the value present on data-ready pad between Data-Ready signal and Interrupt signal. At power up the Data-ready signal is chosen. It is however necessary to modify DRDY bit to enable Data-Ready signal generation. DRDY bit is used to enable Data-Ready (RDY/INT) pin activation. If DRDY bit is `0' (default value) on Data-Ready pad a `0' value is present. If a Data-Ready signal is desired it is necessary to set to `1' DRDY bit. Data-Ready signal goes to `1' whenever a new data is available for all the enabled axis. For example if Z-axis is disabled, Data-Ready signal goes to `1' when new values are available for both X and Y axis. Data-Ready signal comes back to `0' when all the registers containing values of the enabled axis are read. To be sure not to loose any data coming from the accelerometer data registers must be read before a new Data-Ready rising edge is generated. In this case Data-ready signal will have the same frequency of the data rate chosen. SIM bit selects the SPI Serial Interface Mode. When SIM is `0' (default value) the 4-wire interface mode is selected. The data coming from the device are sent to SDO pad. In 3-wire interface mode output data are sent to SDA_SDI pad. DAS bit permits to decide between 12 bit right justified and 16 bit left justified representation of data coming from the device. The first case is the default case and the most significant bits are replaced by the bit representing the sign.
7.10
CTRL_REG3 (22h)
ECK HPDD HPFF FDS res res CFS1 CFS0
ECK HPDD HPFF FDS
External Clock. Default value: 0 (0: clock from internal oscillator; 1: clock from external pad) High Pass filter enabled for Direction Detection. Default value: 0 (0: filter bypassed; 1: filter enabled) High Pass filter enabled for Free-Fall and Wake-Up. Default value: 0 (0: filter bypassed; 1: filter enabled) Filtered Data Selection. Default value: 0 (0: internal filter bypassed; 1: data from internal filter) High-pass filter Cut-off Frequency Selection. Default value: 00 (00: Hpc=512 01: Hpc=1024 10: Hpc=2048 11: Hpc=4096)
CFS1, CFS0
FDS bit enables (FDS=1) or bypass (FDS=0) the high pass filter in the signal chain of the sensor CFS1, CFS0 bits defines the coefficient Hpc to be used to calculate the -3dB cut-off frequency of the high pass filter: 0.318 ODRx f cu toff = -------------- ---------------Hpc 2
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7 Register Description
7.11
HP_FILTER_RESET (23h)
Dummy register. Reading at this address zeroes instantaneously the content of the internal high pass-filter. Read data is not significant.
7.12
STATUS_REG (27h)
ZYXOR ZYXOR ZOR YOR XOR ZYXDA ZDA YDA XDA ZOR YOR XOR ZYXDA ZDA YDA XDA
X, Y and Z axis Data Overrun Z axis Data Overrun Y axis Data Overrun X axis Data Overrun X, Y and Z axis new Data Available Z axis new Data Available Y axis new Data Available X axis new Data Available
7.13
OUTX_L (28h)
XD7 XD7, XD0 XD6 XD5 XD4 XD3 XD2 XD1 XD0
X axis acceleration data LSB
In Big Endian Mode (bit BLE CTRL_REG2 set to `1') the content of this register is the MSB acceleration data and depends by bit DAS in CTR_REG2 reg as described in the following section.
7.14
OUTX_H (29h)
XD15 XD14 XD13 XD12 XD11 XD10 XD15, XD8 X axis acceleration data MSB XD9 XD8
When reading the register in "12 bit right justified" mode the most significant bits (15:12) are replaced with bit 11 (i.e. XD15-XD12=XD11, XD11, XD11, XD11). In Big Endian Mode (bit BLE CTRL_REG2 set to `1') the content of this register is the LSB acceleration data.
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7 Register Description
LIS3LV02DQ
7.15
OUTY_L (2Ah)
YD7 YD7, YD0 YD6 YD5 YD4 YD3 YD2 YD1 YD0
Y axis acceleration data LSB
In Big Endian Mode (bit BLE CTRL_REG2 set to `1') the content of this register is the MSB acceleration data and depends by bit DAS in CTR_REG2 reg as described in the following section.
7.16
OUTY_H (2Bh)
YD15 YD14 YD13 YD12 YD11 YD10 YD15, YD8 Y axis acceleration data MSB YD9 YD8
When reading the register in "12 bit right justified" mode the most significant bits (15:12) are replaced with bit 11 (i.e. YD15-YD12=YD11, YD11, YD11, YD11). In Big Endian Mode (bit BLE CTRL_REG2 set to `1') the content of this register is the LSB acceleration data.
7.17
OUTZ_L (2Ch)
ZD7 ZD7, ZD0 ZD6 ZD5 ZD4 ZD3 ZD2 ZD1 ZD0
Z axis acceleration data LSB
In Big Endian Mode (bit BLE CTRL_REG2 set to `1') the content of this register is the MSB acceleration data and depends by bit DAS in CTR_REG2 reg as described in the following section.
7.18
OUTZ_H (2Dh)
ZD15 ZD15, ZD8 ZD14 ZD13 ZD12 ZD11 ZD10 ZD9 ZD8
Z axis acceleration data MSB
When reading the register in "12 bit right justified" mode the most significant bits (15:12) are replaced with bit 11 (i.e. ZD15-ZD12=ZD11, ZD11, ZD11, ZD11). In Big Endian Mode (bit BLE CTRL_REG2 set to `1') the content of this register is the LSB acceleration data
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7 Register Description
7.19
FF_WU_CFG (30h)
AOI LIR ZHIE ZLIE YHIE YLIE XHIE XLIE
AOI
And/Or combination of Interrupt events interrupt request. Default value: 0. (0: OR combination of interrupt events; 1: AND combination of interrupt events) Latch interrupt request. Default value: 0. (0: interrupt request not latched; 1: interrupt request latched) Enable Interrupt request on Z high event. Default value: 0. (0: disable interrupt request; 1: enable interrupt request on measured accel. value higher than preset threshold) Enable Interrupt request on Z low event. Default value: 0. (0: disable interrupt request; 1: enable interrupt request on measured accel. value lower than preset threshold) Enable Interrupt request on Y high event. Default value: 0. (0: disable interrupt request; 1: enable interrupt request on measured accel. value higher than preset threshold) Enable Interrupt request on Y low event. Default value: 0. (0: disable interrupt request; 1: enable interrupt request on measured accel. value lower than preset threshold) Enable Interrupt request on X high event. Default value: 0. (0: disable interrupt request; 1: enable interrupt request on measured accel. value higher than preset threshold) Enable Interrupt request on X low event. Default value: 0. (0: disable interrupt request; 1: enable interrupt request on measured accel. value lower than preset threshold)
LIR
ZHIE
ZLIE
YHIE
YLIE
XHIE
XLIE
Free-fall and inertial wake-up configuration register.
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7.20
FF_WU_SRC (31h)
X IA ZH ZL YH YL XH XL
IA
Interrupt Active. Default value: 0 (0: no interrupt has been generated; 1: one or more interrupt event has been generated) Z High. Default value: 0 (0: no interrupt; 1: ZH event has occurred) Z Low. Default value: 0 (0: no interrupt; 1: ZL event has occurred) Y High. Default value: 0 (0: no interrupt; 1: YH event has occurred) Y Low. Default value: 0 (0: no interrupt; 1: YL event has occurred) X High. Default value: 0 (0: no interrupt; 1: XH event has occurred) X Low. Default value: 0 (0: no interrupt; 1: XL event has occurred)
ZH ZL YH YL XH XL
7.21
FF_WU_ACK (32h)
Dummy register. If LIR bit in FF_WU_CFG=1 allows the refresh of FF_WU_SRC. Read data is not significant.
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7 Register Description
7.22
FF_WU_THS_L (34h)
THS7 THS6 THS5 THS4 THS3 THS2 THS1 THS0 THS7, THS0 Free-fall / Inertial Wake Up Acceleration Threshold LSB
7.23
FF_WU_THS_H (35h)
THS15 THS14 THS13 THS12 THS11 THS10 THS9 THS15, THS8 Free-fall / Inertial Wake Up Acceleration Threshold MSB THS8
7.24
FF_WU_DURATION (36h)
FWD7 FWD6 FWD5 FWD4 FWD3 FWD2 FWD1 FWD0 FWD7, FWD0 Minimum duration of the Free-fall/Wake-up event
Set the minimum duration of the free-fall/wake-up event to be recognized. FF_WU_Duration (Dec) Duration ( s ) = --------------------------------------------------------------ODR
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7 Register Description
LIS3LV02DQ
7.25
DD_CFG (38h)
IEND LIR ZHIE ZLIE YHIE YLIE XHIE XLIE
IEND
Interrupt enable on Direction change. Default value: 0 (0: disabled; 1: interrupt signal enabled) Latch Interrupt request into DD_SRC reg with the DD_SRC reg cleared by reading DD_ACK reg. Default value: 0. (0: interrupt request not latched; 1: interrupt request latched) Enable interrupt generation on Z high event. Default value: 0 (0: disable interrupt request; 1: enable interrupt request on measured accel. value higher than preset threshold) Enable interrupt generation on Z low event. Default value: 0 (0: disable interrupt request; 1: enable interrupt request on measured accel. value lower than preset threshold) Enable interrupt generation on Y high event. Default value: 0 (0: disable interrupt request; 1: enable interrupt request on measured accel. value higher than preset threshold) Enable interrupt generation on Y low event. Default value: 0 (0: disable interrupt request; 1: enable interrupt request on measured accel. value lower than preset threshold) Enable interrupt generation on X high event. Default value: 0 (0: disable interrupt request; 1: enable interrupt request on measured accel. value higher than preset threshold) Enable interrupt generation on X low event. Default value: 0 (0: disable interrupt request; 1: enable interrupt request on measured accel. value lower than preset threshold)
LIR
ZHIE
ZLIE
YHIE
YLIE
XHIE
XLIE
Direction-detector configuration register
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7 Register Description
7.26
DD_SRC (39h)
X IA ZH ZL YH YL XH XL
IA
Interrupt event from direction change. (0: no direction changes detected; 1: direction has changed from previous measurement) Z High. Default value: 0 (0: Z below THSI threshold; 1: Z accel. exceeding THSE threshold along positive direction of acceleration axis) Z Low. Default value: 0 (0: Z below THSI threshold; 1: Z accel. exceeding THSE threshold along negative direction of acceleration axis) Y High. Default value: 0 (0: Y below THSI threshold; 1: Y accel. exceeding THSE threshold along positive direction of acceleration axis) Y Low. Default value: 0 (0: Y below THSI threshold; 1: Y accel. exceeding THSE threshold along negative direction of acceleration axis) X High. Default value: 0 (0: X below THSI threshold; 1: X accel. exceeding THSE threshold along positive direction of acceleration axis) X Low. Default value: 0 (0: X below THSI threshold; 1: X accel. exceeding THSE threshold along negative direction of acceleration axis)
ZH
ZL
YH
YL
XH
XL
Direction detector source register
7.27
DD_ACK (3Ah)
Dummy register. If LIR bit in DD_CFG=1 allows the refresh of DD_SRC. Read data is not significant.
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7 Register Description
LIS3LV02DQ
7.28
DD_THSI_L (3Ch)
THSI7 THSI7, THSI0 THSI6 THSI5 THSI4 THSI3 THSI2 THSI1 THSI0
Direction detection Internal Threshold LSB
7.29
DD_THSI_H (3Dh)
THSI15 THSI15, THSI8 THSI14 THSI13 THSI12 THSI11 THSI10 THSI9 THSI8
Direction detection Internal Threshold MSB
7.30
DD_THSE_L (3Eh)
THSE7 THSE7, THSE0 THSE6 THSE5 THSE4 THSE3 THSE2 THSE1 THSE0
Direction detection External Threshold LSB
7.31
DD_THSE_H (3Fh)
THSE15 THSE14 THSE13 THSE12 THSE11 THSE10 THSE15, THSE8 Direction detection External Threshold MSB THSE9 THSE8
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8 Typical performance characteristics
8
8.1
Typical performance characteristics
Mechanical Characteristics at 25C
Figure 11. y-axis 0-g level at 2.5V
Figure 10. x-axis 0-g level at 2.5V
20 18 16 Percent of parts (%) Percent of parts (%) -5 0 0-g LEVEL (mg) 5 10 14 12 10 8 6 4 2 0 -10
25
20
15
10
5
0 -10
-5
0 0-g LEVEL (mg)
5
10
Figure 12. z-axis 0-g level at 2.5V
Figure 13. x-axis sensitivity at 2.5V
25
20 18
20 Percent of parts (%) Percent of parts (%) -15 -10 -5 0 5 0-g LEVEL (mg) 10 15 20
16 14 12 10 8 6 4 2
15
10
5
0 -20
0 1010
1015
1020 1025 sensitivity (LSb/g)
1030
Figure 14. y-axis sensitivity at 2.5V
Figure 15. z-axis sensitivity at 2.5V
20 18 16 Percent of parts (%) Percent of parts (%) 1015 1020 1025 sensitivity (LSb/g) 1030 14 12 10 8 6 4 2 0 1010
20 18 16 14 12 10 8 6 4 2 0 1010 1015 1020 1025 sensitivity (LSb/g) 1030
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8 Typical performance characteristics
LIS3LV02DQ
8.2
Mechanical Characteristics derived from measurement in the -40C to +85C temperature range
Figure 17. y-axis 0-g level change vs. temperature at 2.5V
25
Figure 16. x-axis 0-g level change vs. temperature at 2.5V
25
20 Percent of parts (%) Percent of parts (%) 0 0-g level drift (mg/ C) 0.5
20
15
15
10
10
5
5
0 -0.5
0 -0.05
0
0.05
0.1 0.15 0.2 0.25 0-g level drift (mg/ C)
0.3
0.35
Figure 18. z-axis 0-g level change vs. temperature at 2.5V
25
Figure 19. x-axis sensitivity change vs. temperature at 2.5V
25
20 Percent of parts (%) Percent of parts (%) -0.5 0 0.5 0-g level drift (mg/C) 1 Percent of parts (%) 0.006 0.007 0.008 sensitivity drift (%/C) 0.009 0.010
20
15
15
10
10
5
5
0
0 -0.035 -0.034 -0.033 -0.032 -0.031 -0.03 -0.029 -0.028 -0.027 sensitivity drift (%/C)
Figure 20. y-axis sensitivity change vs. temperature at 2.5V
16 14 12 Percent of parts (%) 10 8 6 4 2 0 0.005
Figure 21. z-axis sensitivity change vs. temperature at 2.5V
40 35 30 25 20 15 10 5 0 -0.05
-0.045
-0.04
-0.035 -0.03 -0.025 sensitivity drift (%/C)
-0.02
-0.015
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8 Typical performance characteristics
8.3
Electro-Mechanical characteristics at 25C
Figure 22. x and y axis 0-g level as function of Figure 23. z axis 0-g level as function of supply supply voltage voltage
80 60 40 0-g level (mg) 20 0 -20 -40 -60 -80 2 0-g level (mg) 2.2 2.4 2.6 2.8 3 3.2 Supply Voltage (V) 3.4 3.6 80 60 40 20 0 -20 -40 -60 -80 2
2.2
2.4
2.6 2.8 3 3.2 Supply Voltage (V)
3.4
3.6
Figure 24. Current consumption in PowerDown mode (Vdd=2.5V)
30
Figure 25. Current consumption in Operational mode (Vdd=2.5V)
20 18
25 Percent of parts (%) Percent of parts (%) 0 current consumption (uA) 5
16 14 12 10 8 6 4 2
20
15
10
5
0 -5
0 500
550
600 650 current consumption (uA)
700
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9 Package Information
LIS3LV02DQ
9
Package Information
In order to meet environmental requirements, ST offers these devices in ECOPACK(R) packages. These packages have a Lead-free second level interconnect. The category of second Level Interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.
Figure 26. QFPN-28 Mechanical Data & Package Dimensions
mm DIM. MIN. A A1 A3 b D D1 E E1 e L L1 ddd 0.45 0.30 6.85 4.90 6.85 4.90 0.203 0.35 7.0 5.00 7.0 5.00 0.80 0.55 0.65 0.10 0.08 0.40 7.15 5.10 7.15 5.10 0.012 0.270 0.192 0.270 0.192 0.014 0.275 0.197 0.275 0.197 0.0315 0.018 0..022 0.025 0.004 0.003 1.70 TYP. 1.80 MAX. 1.90 0.05 MIN. 0.067 TYP. 0.071 MAX. 0.075 0.002 0.008 0.016 0.281 0.20 0.281 0.20 inch
OUTLINE AND MECHANICAL DATA
QFPN-28 (7x7x1.8mm) Quad Flat Package No lead
7787120 C
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10 Revision history
10
Revision history
Date 7-Oct-2005 Revision 1 Initial release. Changes
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LIS3LV02DQ
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners (c) 2005 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com
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